?2024年11月18-21日,第十屆國(guó)際第三代半導(dǎo)體論壇(IFWS2024)&第二十一屆中國(guó)國(guó)際半導(dǎo)體照明論壇(SSLCHINA2024)、先進(jìn)半導(dǎo)體技術(shù)應(yīng)用創(chuàng)新展(CASTAS)將在蘇州國(guó)際博覽中心舉辦。
元旭半導(dǎo)體科技股份有限公司(簡(jiǎn)稱"元旭半導(dǎo)體")將攜多款Micro-LED芯片、COB顯示產(chǎn)品亮相此次展會(huì)。值此,誠(chéng)摯邀請(qǐng)第三代半導(dǎo)體產(chǎn)業(yè)同仁共聚論壇,蒞臨A04號(hào)展位參觀交流、洽談合作。?
同時(shí),元旭半導(dǎo)體科技股份有限公司董事會(huì)主席兼首席執(zhí)行官(CEO)席光義將出席論壇,并將在“Mini/Micro-LED技術(shù)產(chǎn)業(yè)應(yīng)用峰會(huì)”上,分享《從芯到屏,垂直整合 開啟Micro-LED智慧顯示時(shí)代》的主題報(bào)告。敬請(qǐng)關(guān)注!
報(bào)告嘉賓
席光義
元旭半導(dǎo)體科技股份有限公司董事會(huì)主席兼首席執(zhí)行官(CEO)?
席光義博士(清華大學(xué)電子工程系),是我國(guó)最早從事GaN基LED、HEMT材料與器件的科研人員之一,師從中國(guó)工程院院士、半導(dǎo)體光電子技術(shù)專家羅毅院士。作為元旭半導(dǎo)體科技股份有限公司董事會(huì)主席兼首席執(zhí)行官(CEO),席光義博士帶領(lǐng)科研隊(duì)伍始終聚焦于Micro LED顯示芯片產(chǎn)業(yè)布局,并建立了具有自主知識(shí)產(chǎn)權(quán)的“IDM 2.0”創(chuàng)新模式技術(shù)體系,解決了我國(guó)大尺寸高光效圖形化藍(lán)寶石襯底嚴(yán)重依賴進(jìn)口的問題。自2003年起,席光義博士開始從事半導(dǎo)體產(chǎn)業(yè)的研發(fā)工作,曾參與國(guó)家重大科技專項(xiàng),并發(fā)表了十余篇論文。2014年,他與團(tuán)隊(duì)共同創(chuàng)立了元旭半導(dǎo)體科技股份有限公司,成功實(shí)現(xiàn)了Micro LED顯示芯片、新型視覺技術(shù)等關(guān)鍵技術(shù)的布局,并積極推動(dòng)Micro LED新一代半導(dǎo)體顯示技術(shù)的產(chǎn)業(yè)升級(jí)。
演講報(bào)告:《從芯到屏,垂直整合 開啟Micro-LED智慧顯示時(shí)代》
演講會(huì)場(chǎng):Mini/Micro-LED技術(shù)產(chǎn)業(yè)應(yīng)用峰會(huì)
關(guān)于元旭半導(dǎo)體Company Profile
元旭半導(dǎo)體科技股份有限公司創(chuàng)立于2014年,致力于Micro-LED芯片技術(shù)和新一代智慧顯示產(chǎn)品的研發(fā)與產(chǎn)業(yè)化創(chuàng)新。?作為Micro-LED顯示行業(yè)的技術(shù)型領(lǐng)軍企業(yè),元旭半導(dǎo)體以自研Micro-LED顯示芯片和先進(jìn)集成封裝技術(shù)作為強(qiáng)支撐,聚焦于新一代智慧顯示產(chǎn)品的設(shè)計(jì)與創(chuàng)新,形成從Micro-LED顯示芯片、先進(jìn)集成封裝到新一代智慧顯示產(chǎn)品的垂直整合智造,創(chuàng)新性地打造了“IDM 2.0”創(chuàng)新模式體系,涵蓋設(shè)計(jì)、研發(fā)、生產(chǎn)、銷售于一體,實(shí)現(xiàn)“從芯到屏”的一站式產(chǎn)業(yè)化布局,在成本控制和產(chǎn)品性能特征方面實(shí)現(xiàn)跨越式地提升。
INNOSHINE Technology Co., Ltd.(“INNOSHINE”)was established in 2014 and is dedicated to the research and industrialization of Micro-LED chip technology and next-generation smart display products.
As a technology-driven pioneer in the Micro-LED display industry, Yuanxu Semiconductor relies on its self-developed Micro-LED display chip and advanced integrated packaging technology as strong support, focusing on the design and innovation of next-generation smart display products. It has formed a vertically integrated smart manufacturing system from Micro-LED display chips, advanced integrated packaging to next-generation smart display products, and has innovatively created a "IDM 2.0" innovation model system, covering design, R&D, production, and sales, to achieve a one-stop industrial layout from "core to screen" and achieve a breakthrough in cost control and product performance characteristics.?For further information on INNOSHINE, please visit our website at: www.novoshine.com.
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產(chǎn)品介紹/about Products
(一)晶圓襯底 Wafer substrate
(1)藍(lán)寶石基材料晶圓襯底——元旭半導(dǎo)體在藍(lán)寶石襯底材料方面實(shí)現(xiàn)多個(gè)全國(guó)首創(chuàng)。2014年,首創(chuàng)完成濕法晶圓襯底,帶領(lǐng)公司率先實(shí)現(xiàn)國(guó)產(chǎn)化;2018年,元旭半導(dǎo)體首創(chuàng)完成六英寸納米晶圓襯底,并實(shí)現(xiàn)大規(guī)模量產(chǎn),著力破解半導(dǎo)體領(lǐng)域“卡脖子”難題。
(2)硅基材料晶圓襯底——作為實(shí)現(xiàn)Micro-LED集成應(yīng)用的關(guān)鍵材料技術(shù),元旭半導(dǎo)體開發(fā)出8英寸、12英寸硅基GaN外延,為實(shí)現(xiàn)晶圓級(jí)集成電路打下堅(jiān)實(shí)基礎(chǔ)。
(1)?Sapphire?substrate?material?wafers?-?INNOSHINE?has?achieved?several?national?firsts?in?sapphire?substrate?material.?In?2014,?it?pioneered?the?wet?process?wafer?substrate,?leading?the?company?to?become?the?first?to?achieve?domestication.?In?2018,?INNOSHINE?pioneered?the?production?of?6-inch?nanocrystalline?wafer?substrate?and?achieved?mass?production,?focusing?on?breaking?the?"neck-tie"?problem?in?the?semiconductor?field.
(2)?Silicon-based?material?wafer?substrate?-?As?a?key?material?technology?for?realizing?Micro-LED?integrated?applications,?INNOSHINE?has?developed?8-inch?and?12-inch?silicon-based?GaN?epitaxy,?laying?a?solid?foundation?for?wafer-level?integrated?circuits.?
(二)Micro-LED芯片 Micro-LED chip
元旭半導(dǎo)體自研全新Micro-LED芯片,重新定義Micro-LED芯片結(jié)構(gòu)及IDM?2.0集成工藝架構(gòu),將LED行業(yè)分離器件跨入到Micro-LED集成芯片時(shí)代。在Micro-LED技術(shù)的研發(fā)上,不僅突破了芯片設(shè)計(jì)、微型化薄膜芯片、巨量轉(zhuǎn)移、超高精度布線等關(guān)鍵技術(shù),更實(shí)現(xiàn)了超高清像素直顯、低功耗超節(jié)能、高亮度、寬色域、高對(duì)比度、寬視角、高動(dòng)態(tài)特性、高可靠性等優(yōu)異顯示性能,并通過優(yōu)化芯片排布方式、無引線電連接、封裝結(jié)構(gòu)和表面處理工藝,進(jìn)一步提高產(chǎn)品可靠性,為Micro-LED新型顯示技術(shù)的革新提供強(qiáng)有力支撐。
INNOSHINE?has?developed?a?brand?new?Micro-LED?chip,?redefining?the?Micro-LED?chip?structure?and?IDM?2.0?integrated?process?architecture,?bringing?the?LED?industry?from?a?separable?device?era?to?the?Micro-LED?integrated?chip?era.?In?the?research?and?development?of?Micro-LED?technology,?not?only?has?INNOSHINE?broken?through?key?technologies?such?as?chip?design,?miniaturization?of?thin?film?chips,?mass?transfer,?ultra-high?precision?wiring,?but?it?has?also?achieved?excellent?display?performance?such?as?ultra-high?resolution?pixel?direct?display,?low?power?consumption?and?ultra-energy?saving,?high?brightness,?wide?color?gamut,?high?contrast?ratio,?wide?viewing?angle,?and?high?dynamic?characteristics,?as?well?as?high?reliability.?Furthermore,?by?optimizing?the?chip?layout,?wirelessly?connecting?the?chips,?and?improving?the?packaging?structure?and?surface?treatment?process,?INNOSHINE?has?further?enhanced?the?reliability?of?its?products,?providing?strong?support?for?the?innovation?of?Micro-LED?new?display?technology.?
(三)全倒裝COB LED顯示屏 Full-flip?COB?LED?Display
在“自主性研發(fā)+智能化制造自主化生產(chǎn)”雙重核心能力的驅(qū)動(dòng)下,元旭半導(dǎo)體依托天津、無錫集成光電子整合智造工廠,原廠生產(chǎn)并成體系推出“Xmeta”、“光璨”、“LEG GO”三大系列產(chǎn)品,產(chǎn)品分別定位于專業(yè)顯示、商業(yè)顯示與場(chǎng)景化解決方案顯示,真正實(shí)現(xiàn)從芯片設(shè)計(jì)到封測(cè)的高度自主可控。
元旭半導(dǎo)體COB顯示產(chǎn)品全面搭載級(jí)半導(dǎo)體級(jí)生產(chǎn)工藝,并在超精密生產(chǎn)環(huán)境(百級(jí)潔凈空間)中進(jìn)行制造,顯著降低生產(chǎn)過程中異物對(duì)Micro-LED產(chǎn)品良品率和質(zhì)量穩(wěn)定性的影響。COB顯示產(chǎn)品特有的高亮度、高對(duì)比度、高分辨力、低電壓驅(qū)動(dòng)、低功耗、低屏溫、長(zhǎng)壽命等突出特點(diǎn),為指揮控制中心、大數(shù)據(jù)中心、智慧城市、數(shù)字孿生、工業(yè)仿真、文旅文化產(chǎn)業(yè)等對(duì)畫質(zhì)有較高要求的應(yīng)用環(huán)境而進(jìn)行高端化定制。元旭半導(dǎo)體積極推動(dòng)Micro-LED技術(shù)發(fā)展,使其逐步拓展ToB及ToC市場(chǎng)。
Driven?by?the?dual?core?capabilities?of?independent?R&D?and?intelligent?manufacturing?and?production,?INNOSHINE?has?relied?on?its?integrated?optoelectronics?integration?and?manufacturing?factories?in?Tianjin?and?Wuxi?to?produce?and?systematically?launch?the?"Xmeta",?"G",?and?"LEG?GO"?product?series.?The?products?are?respectively?positioned?in?professional?display,?commercial?display,?and?scene-based?solution?display,?and?truly?achieve?full?control?over?the?chip?design?and?packaging?and?testing?from?a?height?of?autonomy.
INNOSHINE's?COB?display?products?are?fully?equipped?with?semiconductor-level?production?processes?and?manufactured?in?ultra-precise?production?environments?(class?100?clean?space),?significantly?reducing?the?impact?of?foreign?objects?on?the?Micro-LED?product?yield?and?stability.?The?COB?display?products?have?distinctive?features?such?as?high?brightness,?high?contrast?ratio,?high?resolution,?low?voltage?driving,?low?power?consumption,?low?screen?temperature,?and?long?life,?which?are?specially?tailored?for?high-end?customization?for?application?environments?with?high?requirements?for?image?quality,?such?as?command?and?control?centers,?big?data?centers,?smart?cities,?digital?twins,?industrial?simulation,?and?cultural?and?tourism?industries.?INNOSHINE?actively?promotes?the?development?of?Micro-LED?technology?to?gradually?expand?its?market?to?both?B?and?C?segments.
參會(huì)聯(lián)系:
今年,第十屆國(guó)際第三代半導(dǎo)體論壇&第二十一屆中國(guó)國(guó)際半導(dǎo)體照明論壇(IFWS&SSLCHINA2024)將于11月18-21日在蘇州國(guó)際博覽中心舉辦,國(guó)內(nèi)外院士專家齊聚,數(shù)十場(chǎng)會(huì)議活動(dòng),數(shù)百位報(bào)告嘉賓,全產(chǎn)業(yè)鏈知名企業(yè)參與&參展,內(nèi)容全面覆蓋行業(yè)工藝裝備、原材料、技術(shù)、產(chǎn)品與應(yīng)用各環(huán)節(jié),融合聚集產(chǎn)、學(xué)、研、用、政、金多個(gè)層面的資源,年度國(guó)際第三代半導(dǎo)體產(chǎn)業(yè)“風(fēng)向標(biāo)”盛會(huì),11月相聚蘇州,共襄盛會(huì),共謀發(fā)展!歡迎業(yè)界同仁咨詢參展參會(huì),免費(fèi)觀展交流合作!》》》最新60+報(bào)告嘉賓公布!IFWS&SSLCHINA2024報(bào)名中!
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